Senior 3DIC Physical Design Engineer at Antal International

Job Description:

Latest job information from Antal International for the position of Senior 3DIC Physical Design Engineer. If the Senior 3DIC Physical Design Engineer vacancy in Belgium matches your qualifications, please submit your latest application or CV directly through the updated Jobkos job portal.

Please note that applying for a job may not always be easy, as new candidates must meet certain qualifications and requirements set by the company. We hope the career opportunity at Antal International for the position of Senior 3DIC Physical Design Engineer below matches your qualifications.

For our client, we are seeking a 3DIC Physical Design Engineer to work on cutting‑edge 3D integration technologies, driving innovation in next‑generation semiconductor systems.

We’re hiring on behalf of a leading global research center pioneering the future of chip integration.

Join an international R&D team working at the edge of semiconductor innovation: 2.5D/3DIC design, Chiplet integration, and advanced physical implementation flows.

As a 3DIC Physical Design Engineer, you’ll develop and implement physical design strategies for complex multi-die systems. You’ll help shape the next generation of high-performance, low‑power chip architectures.

• Design high‑speed clock buses across dies to meet strict PPA (Power, Performance, Area) targets
• Contribute to floorplanning, interconnect, power delivery, and thermal design in 2.5D/3DIC systems
• Define and apply signoff methodologies for multi-die integration
• Support STCO/DTCO initiatives to co‑optimize architecture and technology
• Collaborate with experts across architecture, design, packaging, and fabrication

• Proven experience in back‑end physical implementation, with large‑scale chip design and verification (RTL2GDS)
• Solid understanding of physical design flows, EDA tools (e.g., Cadence, Synopsys), and timing closure techniques
• Hands‑on experience with high‑speed bus planning, 3DIC or Chiplet designs
• Familiarity with advanced semiconductor processes (e.g., FinFET, 7nm/5nm), including design rules and process constraints
• Knowledge of reliability, power integrity, and thermal management in multi‑die systems
• Experience translating system/product requirements into chip architecture and floorplan strategies

• Master’s degree or PhD in Electronics, Computer Engineering, Physics, Materials Science, or related field
• 5–10 years of relevant industry experience

Be part of a team redefining how the most advanced chips are physically built.

Antal International Paris London

Job Info:

• Company: Antal International
• Position: Senior 3DIC Physical Design Engineer
• Work Location: Belgium
• Country: BE

How to Submit an Application:

After reading and understanding the criteria and minimum qualification requirements explained in the job information Senior 3DIC Physical Design Engineer at the office Belgium above, immediately complete the job application files such as a job application letter, CV, photocopy of diploma, transcript, and other supplements as explained above. Submit via the Next Page link below.